msdp50 document number: msdp50 www. jan.28, 2011 1 smsemi .com features y high thermal conductivity packge,electrically insulated case y glass passivated chips y high ifsm y epoxy compound has classification ul94v-0 glass passivated three phase bridge rectifiers v rrm 800 to 1600v i fav 50amp circuit + - ~ ~ ~ applications y big power supplier y field supply for dc motor module type type v rrm v rsm msdp50-08 msdp50-12 MSDP50-16 800v 1200v 1600v 900v 1300v 1700v maximum ratings symbol item conditions values units i f(av) average forward current tc=50 50 a i fsm forward surge current, max. t=10ms tvj =45 500 a i 2 t value for fusing 1250 a 2 s visol isolation breakdown voltage(r.m.s) a.c.50hz;r.m.s.;1min 2500 v tvj operating junction temperature -40 to +150 tstg storage temperature -40 to +150 weight approximate weight 20 g thermal characteristics symbol item conditions values units r th(j-c) thermal impedance, max. junction to case 0.65 /w electrical characteristics values symbol item conditions min. typ. max. units v fm forward voltage drop, max. t=25 i f =25a 1.00 1.20 v 5 a i rrm repetitive peak reverse current, max. t vj =25 v rd =v rrm t vj =150 v rd =v rrm 3 ma
msdp50 document number: msdp50 www. jan.28, 2011 2 smsemi .com performance curves 50 a 40 30 20 10 0 if 100 a 80 60 40 20 0 i d typ. 0 vf 0.5 1.0 1.5 v 2.0 0 tc 50 100 150 fig1.forward current derating curve fig2. forward characteristics 1000 a 500 0 1.0 / w 0.5 0 50hz z th(j- c ) 0.001 0.01 0.1 1 10 s 100 1 10 cycles 100 fig4. max non-repetitive forward surge current fig3. transient thermal impedance
msdp50 document number: msdp50 www. jan.28, 2011 3 smsemi .com package outline information dimensions in mm case p1
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